Layout Guidelines
Good thermal contact between the MAX5900/
MAX5901 and the external MOSFET is essential for the
thermal shutdown feature to operate effectively. Place
the MAX5900/MAX5901 as close as possible to the
drain of the external MOSFET, and use wide circuit
board traces for good heat transfer. See Figure 5 for an
example of a PC board layout.
Chip Information
TRANSISTOR COUNT: 678
PROCESS: BiCMOS
-100V, SOT23/TDFN, Simple Swapper
Hot-Swap Controllers
_______________________________________________________________________________________ 9
Figure 5. Circuit Board Layout Example
GROUND
POWER IN
POWER
OUT
M1
SOT-223
S D G
U1
SOT23-6
MAX5900/MAX5901
V
+
-
GND
ON/OFF
V
EE
GATE DRAIN
PGOOD
(PGOOD)
V
IN
100礔
MAX5900
MAX5901
100k&
V
+
-
GND
ON/OFF
V
EE
GATE DRAIN
PGOOD
(PGOOD)
V
IN
V
50k&
MAX5900
MAX5901
V
+
-
GND
ON/OFF
V
EE
GATE DRAIN
PGOOD
(PGOOD)
V
IN
MAX5900
MAX5901
100k&
V
+
-
GND
ON/OFF
V
EE
GATE DRAIN
PGOOD
(PGOOD)
48V
MAX5900A
MAX5901A
50k&
SCOPE
SCOPE
+
-
GND
ON/OFF
V
EE
GATE DRAIN
PGOOD
(PGOOD)
48V
C
L
MAX5900
MAX5901
50k&
R
L
SCOPE
SCOPE
SCOPE
SCOPE
SCOPE
+
-
GND
ON/OFF
V
EE
GATE DRAIN
PGOOD
(PGOOD)
48V
MAX5900
MAX5901
50k&
50k&
SCOPE
SCOPE
SCOPE
(a) SUPPLY CURRENT
(c) GATE DRIVE VOLTAGE
(e) TURN-ON WAVEFORMS
(b) V
UVLO
(d) RETRY TIMEOUT
(f) CIRCUIT-BREAKER EVENT
Figure 6. Test Circuits
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